1) Yes
2) Yes
3) I believe it was damaged due to extra rubbing on sandpaper because after burning the plastic from the back, I tried twice to put the sim (pasted on MicroSD card) and Sim tray but never successful to insert the sim tray in Mi Max due to the thickness even after rubbing/grinding the other side of MicroSD card. (it is shown in one of the video to grind the SD card).
First time after removing the bump a little I tried to stick the sim and the sim tray was not going inside the phone so I removed the sim from the microSD card and used it as it is (it was working then) then after few days I rubbed the bump the circuit side of the sim on sandpaper and pasted again on MicroSD and tried it again, even then I was unable to push the sim tray inside the phone but after removing the sim (pasted on the MicroSD) from the MicroSD card second time, I inserted it again but was unable to get any signals from it.
In short I was never able to push the sim and the sim tray inside Mi Max (tried twice), it was not as thin that the sim tray would insert in the phone, but after second try I lost all the signals from the sim, so I believe that it was broken while trying second time due to extra grinding of the bump circuit side.